At MWC 2026, MediaTek is pulling back the curtain on one of its most ambitious showcases to date: “AI For Life: From Edge to Cloud.” The exhibition, anchored by a keynote from President Joe Chen, underscores the company’s vision of a seamlessly connected, AI-powered world—one that extends from personal devices at the network edge to hyperscale cloud infrastructure.

Held in Hall 8 on March 4, the keynote brings together MediaTek executives and key ecosystem partners to outline collaborative efforts shaping the future of mobile computing, automotive connectivity, and next-generation AI. At the booth, attendees will experience hands-on demonstrations of cutting-edge breakthroughs across 6G communications, 5G-Advanced CPE with Wi-Fi 8, edge AI for smartphones and IoT, automotive satellite connectivity, and advanced data centre silicon.

The message is clear: MediaTek isn’t just building chips—it’s architecting an intelligent, always-connected ecosystem powered by advanced silicon and AI acceleration.

6G Leadership: Intelligent Connectivity Built for AI

At the forefront of MediaTek’s MWC presence is its aggressive push into 6G development. As an active contributor to emerging 6G standards, the company is showcasing what it describes as the world’s first 6G radio interoperability demonstration. The breakthrough highlights unprecedented flexibility in balancing throughput, latency, and power efficiency—three pillars that will underpin next-generation AI services, including generative and agentic AI workloads.

MediaTek’s 6G demonstrations go beyond raw radio performance. The company is introducing a bold concept called the “personal device cloud.” In this vision, AI agents seamlessly collaborate across personal and household devices over Wi-Fi or 6G networks, forming a secure, distributed computing environment. Rather than relying entirely on centralised cloud infrastructure, workloads intelligently shift between local and remote resources to maintain privacy, responsiveness, and continuity.

One of the technical highlights is AI-accelerated uplink transmit diversity (TxD) for 6G. Unlike traditional rule-based radio management, MediaTek’s AI-driven approach dynamically learns network conditions in real time, optimising uplink performance for significantly improved efficiency and reliability.

The company is also illustrating how 6G and edge computing will enable next-generation robotics. By tapping into distributed edge compute resources, robots can access compute-intensive applications on demand, dramatically improving responsiveness and enabling more sophisticated real-world interactions.

World’s First 5G-Advanced CPE with Wi-Fi 8

MediaTek is also redefining fixed wireless access with the unveiling of the world’s first 5G-Advanced CPE device integrated with Wi-Fi 8. Powered by the new MediaTek T930 modem and Filogic 8000 series connectivity chipsets, the device supports the latest 3GPP Release 18 standard.

This CPE introduces several industry firsts:

• Eight receive antennas, increasing spectrum efficiency by over 40%.

• Three transmit antennas with five MIMO layers, boosting uplink throughput by 40%.

• Integrated AI network acceleration from the edge.

The onboard AI network engine integrates AI L4S (Low Latency, Low Loss, Scalable throughput) and AI-driven QoS, delivering up to 10x lower latency across both uplink and downlink. Crucially, this acceleration works for both L4S-enabled and legacy applications—without requiring changes to core network infrastructure or backend systems.

By combining standards-based L4S acceleration with intelligent application pattern recognition, MediaTek is positioning its CPE solution as a future-proof foundation for bandwidth-intensive and latency-sensitive workloads such as cloud gaming, real-time collaboration, and AI-driven services.

Automotive Connectivity: Satellite Video Calls and 3nm Smart Cockpits

Automotive innovation is another major focus at MWC 2026.

MediaTek is demonstrating the world’s first 5G NR NTN (Non-Terrestrial Network) video call in an automotive environment. NR NTN enables high-speed satellite communications that extend broadband connectivity far beyond terrestrial coverage zones. This means vehicles can support video streaming, app usage, and live communications even in remote or underserved regions.

Complementing this milestone is a new telematics chipset supporting both 5G-Advanced Release 17 and Release 18 standards. The platform integrates modem-level AI to enhance signal stability, optimize handoffs, and maintain consistent performance under varying network conditions.

Inside the vehicle cabin, MediaTek is unveiling a new Dimensity Auto smart cockpit platform, built on a cutting-edge 3-nanometer automotive-grade process. The system features:

• A high-performance multi-core CPU based on Arm v9.2 architecture

• Advanced GPU capabilities supporting console-level gaming with ray tracing

• A powerful NPU designed to enable generative AI voice assistants

By combining advanced graphics, AI processing, and strict automotive-grade reliability, MediaTek aims to transform the in-vehicle experience into a secure, intelligent, and immersive computing environment.

AI-Powered Mobile Innovation with Dimensity 9500

In the mobile segment, MediaTek continues to strengthen its flagship smartphone position with the Dimensity 9500 platform. As a leading supplier of premium smartphone SoCs, the company is emphasising advanced on-device AI processing powered by its integrated NPU.

The Dimensity 9500 enables highly responsive, private, and secure AI workloads to run locally—reducing reliance on cloud inference and minimising latency. From advanced computational photography to real-time language translation and AI-generated content, edge AI is becoming a defining capability of flagship smartphones.

MediaTek is also unveiling new AI-powered glasses designed for true end-to-end on-device AI collaboration with smartphones. Powered by the Dimensity 9500’s NPU and leveraging an advanced multimodal large model, the glasses support seamless interaction across text, image, speech, and video inputs.

The emphasis is on instant response and privacy. Rather than streaming sensitive data to remote servers, AI processing remains on-device, enabling real-time interaction while maintaining data security.

Data Centre Innovation: UCIe-Advanced and Co-Packaged Optics

MediaTek’s “Edge to Cloud” narrative extends deep into the data centre.

The company is unveiling a newly developed in-house UCIe-Advanced IP solution for die-to-die connectivity. Silicon-validated on TSMC’s advanced 2nm and 3nm processes, the technology supports advanced packaging techniques including silicon interposers and bridges.

Key specifications include:

• Ultra-low bit-error-rate signaling

• Ultra-low power consumption

• Bandwidth densities reaching up to 10 terabits per second per millimetre of die edge

In parallel, MediaTek is demonstrating an in-house co-packaged optics (CPO) solution designed to overcome the physical limitations of traditional copper interconnects. The system paves the way for data transfer speeds up to 400 Gbps per fibre, while dramatically improving energy efficiency and integration density.

By co-optimising electrical, optical, thermal, and mechanical design, MediaTek aims to maximise performance per watt and performance per total cost of ownership (TCO). The company argues that in the AI era, the defining metrics are no longer raw TOPS figures—but rather tokens per watt and tokens per dollar at the rack level.

High-Performance Compute and IoT Demonstrations

At its MWC booth, MediaTek is also highlighting high-performance compute capabilities on the NVIDIA DGX Spark, featuring the NVIDIA GB10 Grace Blackwell Superchip co-designed by MediaTek. This demonstration showcases the company’s role in enabling AI acceleration at hyperscale.

IoT innovation is equally prominent. MediaTek is presenting the world’s first AI interpreter hub, designed to deliver real-time multilingual translation in distributed environments.

Additionally, attendees can explore on-device AI capabilities for Chromebooks powered by the MediaTek Kompanio Ultra, underscoring the company’s push to bring AI acceleration to mainstream computing platforms.

A Unified Vision: Intelligent Ecosystems from Edge to Cloud

From 6G interoperability and AI-accelerated CPE to automotive satellite connectivity, AI glasses, and hyperscale data center interconnects, MediaTek’s MWC 2026 showcase paints a cohesive picture.

Rather than treating connectivity, AI, and compute as separate silos, the company is positioning itself as a systems architect—designing silicon platforms that enable distributed intelligence across devices, vehicles, networks, and cloud infrastructure.

As President Joe Chen emphasised, these innovations are not merely technical milestones. They represent foundational building blocks for new products, standards, and services that aim to reshape everyday experiences for consumers and enterprises worldwide.

At MWC 2026, MediaTek isn’t just demonstrating faster speeds or more powerful chips—it’s articulating a comprehensive strategy for how AI and connectivity will converge to power the next generation of intelligent ecosystems.