MediaTek has unveiled three new additions to its Dimensity family, aiming to bring high-performance experiences to a wider range of mobile devices. The Dimensity 7400, 7400X, and 6400 chipsets are designed to complement the flagship Dimensity 9400 and premium 8400, focusing on efficiency, advanced gaming, AI capabilities, and enhanced 5G connectivity.

Dimensity 7400 and 7400X: Powering Advanced Gaming and AI Cameras

The Dimensity 7400 and 7400X, built on TSMC’s 4nm process, target users seeking advanced gaming and AI camera technology. Both chips feature an octa-core CPU with 4x Arm Cortex-A78 cores (up to 2.6GHz) and 4x Arm Cortex-A55 cores (up to 2.0GHz), coupled with an Arm Mali-G615 MC2 GPU.

MediaTek claims these chipsets offer significant power efficiency, boasting a 14% to 36% reduction in power consumption during gaming compared to competitors. They also support MediaTek Advanced Gaming Technology (MAGT) 3.0, enhancing graphics performance, optimizing game settings with AI, reducing input lag, and improving power savings for extended gaming sessions.

The MediaTek NPU 6.0 boosts AI performance, offering a 15% improvement over the Dimensity 7300. The Imagiq 950 ISP enables advanced AI camera features, including improved low-light performance and Google Ultra HDR support for vivid images and videos.

Key features of the Dimensity 7400 and 7400X include:

• Dual display flip phone support (7400X) for increased OEM design flexibility.
• 5G R16 modem with 3CC carrier aggregation (3CC-CA) and MediaTek UltraSave 3.0+ for 20% lower power consumption.
• Tri-band Wi-Fi 6E support.

Dimensity 6400: Bringing Enhanced 5G to Mainstream Devices

The Dimensity 6400, the latest addition to the Dimensity 6000 series, focuses on delivering enhanced 5G connectivity to more affordable devices. Built on TSMC’s 6nm process, it features an octa-core CPU with 2x Arm Cortex-A76 cores (up to 2.5GHz) and 6x Arm Cortex-A55 cores (up to 2.0GHz), along with an Arm Mali-G57 MC2 GPU.

MediaTek highlights the Dimensity 6400’s power efficiency, claiming up to 19% less power consumption during gaming than competitors.

Key features include:

• MediaTek Bluetooth Wi-Fi HyperCoex Technology for up to 90% reduced gaming latency.
• Release 16 Sub-6 5G Modem with 2CC-CA for improved connectivity.
• Up to 33% faster downlink and 18% faster uplink speeds.
• Support for billion-color displays with real 10-bit images and videos.
• 108MP camera sensor support with MediaTek and Arcsoft’s MFNR and LPNR for improved image quality.

Availability

Smartphones powered by the Dimensity 7400 and 7400X are expected to be available in Q1 2025, while the Dimensity 6400 is already available.

“With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business.