Mobile World Congress 2025 which will start next week is already buzzing with MediaTek’s latest breakthroughs, showcasing a clear vision for the future of wireless connectivity and AI integration. From groundbreaking 6G technologies to powerful new chipsets, MediaTek is demonstrating its commitment to shaping the next generation of devices and networks.
“We’re pushing forward industry-leading connectivity and AI applications through high-quality products and global standardization,” stated Joe Chen, President of MediaTek. This focus is evident in their showcase, highlighting advancements in 6G-era technologies, generative AI hybrid computing, and 5G-advanced solutions.
Paving the Way to 6G: Hybrid Computing and Spectrum Efficiency
MediaTek is spearheading 6G development with its Hybrid Computing innovation, a crucial step towards integrating device, cloud, and RAN into an “edge cloud.” This approach, demonstrated in collaboration with NVIDIA, Intel, and G REIGNS, promises to revolutionize low-latency applications like generative AI and data privacy.
Furthermore, Sub-Band Full Duplex (SBFD) technology is tackling spectrum efficiency, a critical aspect of 6G. MediaTek’s demonstration with Keysight showcases significant progress in mitigating self-interference, particularly vital for compact devices like smartphones.
The M90 5G Advanced Modem: Speed and Intelligence Redefined
The upcoming M90 5G-Advanced modem is set to deliver blistering speeds of up to 12Gbps. This modem also boasts 3GPP Release 17 and 18 support, simultaneous FR1+FR2 connectivity, and an AI-powered Smart Antenna that optimizes signal quality based on user scenarios. MediaTek UltraSave technology further enhances the M90’s efficiency, reducing power consumption by up to 18%. Live network demonstrations with Ericsson prove its real-world capabilities, achieving 10Gbps throughput.
AI Everywhere: From Smartphones to Smart Homes
MediaTek is extending AI beyond smartphones with its Generative AI Gateway and Context Synchronization system. This innovative approach decentralizes Gen-AI capabilities, bringing them to all connected devices while prioritizing data privacy.
The Dimensity 9400 5G chip, powering a range of smartphones on display, showcases the company’s advancements in generative and agentic AI, photography, videography, and gaming. Expect features like AI Audio Focus, AI Telephoto, and ray-traced graphics to redefine user experiences.
Connectivity Beyond Boundaries: Satellite and Automotive
MediaTek’s leadership in 5G-Advanced Non-Terrestrial Network (NTN) technology is evident in its live LEO broadband NR-NTN trial with OneWeb and Eutelsat. This demonstration paves the way for ubiquitous broadband connectivity via satellite.
The Dimensity Auto platform highlights MediaTek’s commitment to the automotive sector. Showcasing advanced multimedia, 3D graphics, and AI processing capabilities, the platform is powering innovative eCockpit experiences with 8K displays.
High-Performance Interconnect: 224G SerDes for the AI Era
MediaTek’s 224G SerDes solution addresses the demanding interconnect requirements of AI, hyperscale computing, and data centres. This technology offers exceptional performance, reliability, and efficiency, empowering ASIC customers with advanced process technology.
A Glimpse into the Future
MediaTek’s presence at MWC 2025 paints a compelling picture of the future. From seamless 6G connectivity to pervasive AI integration, the company is driving innovation across multiple domains. With cutting-edge technologies and strategic partnerships, MediaTek is poised to play a pivotal role in shaping the next generation of digital experiences.
