MediaTek has just unveiled the Dimensity 8300, a power-efficient chipset tailored for high-end 5G smartphones. As the latest addition to the Dimensity 8000 series, this chipset merges generative AI capabilities, energy-saving features, adaptive gaming tech, and swift connectivity, aiming to deliver flagship-grade experiences within the premium 5G smartphone domain.

Crafted on TSMC’s 2nd generation 4nm process, the Dimensity 8300 hosts an octa-core CPU with four Arm Cortex-A715 cores and four Cortex-A510 cores, built on Arm’s v9 CPU architecture. This setup enhances CPU performance by 20% and achieves 30% better power efficiency compared to its predecessor. The chipset’s Mali-G615 MC6 GPU upgrade elevates performance by up to 60% while improving power efficiency by 55%. Its high-speed memory and storage ensure seamless experiences in gaming, lifestyle apps, photography, and more.

Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business Unit, emphasized, “Consumers no longer need to compromise between accessibility and premium experiences with MediaTek’s optimized Dimensity 8000 series—they can have both.” The Dimensity 8300 empowers users with in-hand AI, immersive entertainment, and robust connectivity, all while maintaining efficiency.

Distinguishing itself as the first premium-tier SoC with full generative AI support, the Dimensity 8300 integrates the APU 780 AI processor, facilitating innovative app development leveraging large language models (LLMs) up to 10B and stable diffusion. Its AI capabilities, coupled with MediaTek’s 14-bit HDR-ISP Imagiq 980, promise elevated smartphone photography and video capturing experiences, supporting 4K60 HDR video recording.

Moreover, MediaTek’s HyperEngine adaptive game technology and the built-in 3GPP Release-16 standard 5G modem amplify power efficiency, connectivity, and gaming experiences. The chipset supports ultra-fast speeds, carrier aggregation, and other enhancements like LP5x memory, improved 5G power efficiency, upgraded Wi-Fi 6E performance, and the Dimensity 5G Open Resource Architecture (DORA).

Other key features of the MediaTek Dimensity 8300 include:

• LP5x 8533Mbps and uFS4.0 MCQ memory provide a 33% speed boost on LPDDR and up to 100% faster R/W to flash compared to Dimensity 8300’s predecessor.
• MediaTek 5G UltraSave 3.0+ improves 5G power efficiency by up to 20% in daily usage scenarios compared to the previous generation.
• Upgraded Wi-Fi 6E performance with 160 MHz bandwidth, plus Wi-Fi/Bluetooth hybrid coexistence technology so earbuds, wireless gamepads, and other peripherals work together seamlessly.
• Dimensity 5G Open Resource Architecture (DORA), allows device makers to create unmatched smartphones that stand out in unique ways amongst competitors.

The Dimensity 8300 is set to power 5G devices launching globally by the end of 2023, promising enhanced efficiency and premium-level experiences across various smartphone functionalities.