MediaTek has unveiled the Dimensity 7300 and Dimensity 7300X, a pair of ultra-efficient 4nm chips for advanced mobile devices. These chipsets offer top-tier power efficiency and impressive performance, enabling smooth multitasking, enhanced photography, accelerated gaming, and AI-driven computing. The Dimensity 7300X is specially designed for flip-style foldable devices, featuring support for dual displays.

Both chipsets incorporate an octa-core CPU with 4x Arm Cortex-A78 cores running at up to 2.5GHz and 4x Arm Cortex-A55 cores. The 4nm process reduces power consumption by up to 25% in the A78 cores compared to the Dimensity 7050. Complemented by the Arm Mali-G615 GPU and MediaTek’s HyperEngine optimizations, these CPUs deliver exceptional gaming performance with 20% faster FPS and 20% improved energy efficiency over competitors. The chips employ smart resource management and optimized 5G and Wi-Fi game connections to elevate gaming further and support Bluetooth LE Audio with Dual-Link True Wireless Stereo Audio.

Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business, stated, “The MediaTek Dimensity 7300 chips are crucial for integrating the latest AI and connectivity features, enabling seamless streaming and gaming experiences for consumers. The Dimensity 7300X allows OEMs to innovate with new form factors due to its dual display support.”

The Dimensity 7300 chipsets also enhance photography through the MediaTek Imagiq 950, which includes a 12-bit HDR-ISP supporting up to a 200MP main camera. With advanced hardware for noise reduction (MCNR), face detection (HWFD), and video HDR, users can capture stunning images and videos in various lighting conditions. The live focus photo performance is up to 1.3x faster, and photo remastering is up to 1.5x quicker than the Dimensity 7050. Additionally, users can record 4K HDR video with over 50% wider dynamic range than competitors, bringing out more details in videos.

AI task efficiency is significantly enhanced with the MediaTek APU 655, delivering double the performance of the Dimensity 7050. The Dimensity 7300 chips also support new mixed-precision data types, optimizing memory bandwidth and reducing requirements for larger AI models.

MediaTek’s MiraVision 955 enhances media streaming and playback with support for WFHD+ displays, 10-bit true colour, and global HDR standards. The Dimensity 7300X’s dedicated support for dual-display flip phones facilitates OEMs in meeting the rising demand for innovative device designs.

Other notable features of the Dimensity 7300 and Dimensity 7300X include:

• MediaTek 5G UltraSave 3.0+ technology: Incorporating a suite of R16 power-saving enhancements and MediaTek’s optimizations, providing 13-30% greater power efficiency than competitors in common 5G sub-6GHz scenarios.
• 5G downlink speeds up to 3.27Gb/s: Achieved through 3CC carrier aggregation, offering faster speeds in urban and suburban environments.
• Tri-band Wi-Fi 6E support: Ensures fast and reliable multi-gigabit wireless connectivity.
• Dual 5G SIM support with dual VoNR: Offers users more flexibility and choice.